Plasma-Enhanced Chemical Vapor Deposition (PECVD) is a process that utilizes plasma to accelerate chemical reactions in vapor deposition. In contrast to traditional methods, PECVD operates at lower temperatures, making it ideal for sensitive substrates that cannot withstand high heat. This technique generates reactive species that facilitate the deposition of thin films or coatings. PECVD is widely used in semiconductor manufacturing, solar cell production, optical coatings, and surface treatments, offering a versatile solution for creating high-quality materials in various industries.